PCB Fabrication
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PCB Fabrication
Merit Assembly has over 20 years experience in PCB manufacturing from commercial quick turn FR4 rigid boards to complex HDI and High Frequency fabrication 42+ layers and mixed material stack ups at 60Ghz. Merit also supports full Flex and Rigid/Flex PCBs for all standard to complex applications.
| Specifications | Standard | Advanced |
|---|---|---|
| Min Trace/Space | 75 microns | 50 microns |
| Smallest Mechanical Drill | 0.150 mm | 0.100 mm |
| Smallest Laser Drill | 0.075 mm | 0.050 mm |
| Max Aspect Ratio | 8:01 | 14:01 |
| Max Blind Via Aspect Ratio | 0.7:1 | 1:01 |
| Min Internal Pad Size | DHS + 0.350 mm | DHS + 0.200 mm |
| Min Clearance Pad Size | DHS + 0.600 mm | DHS + 0.400 mm |
| Min External Pad Size | DHS + 0.250 mm | DHS + 0.200 mm |
| Min Pad Size for Selective Plating | DHS + 0.450 mm | DHS + 0.400 mm |
| Min Soldermask Clearance | 0.075 mm per side | 0.050 mm per side |
| Min Soldermask Webbing | 0.150 mm | 0.100 mm |
| Min Mask Defined Pad Diameter | 0.125 mm | 0.100 mm |
| Min Coverlay Clearance | 0.200 mm per side | 0.125 mm per side |
| Min Feature-to-Board Edge | 0.250 mm | 0.075 mm |
| Number of Layers | 1 to 24 | Up to 40 |
| HDI Capabilities | Yes | Sintering Paste Technology |
| Max Flex Length | 57.15 cm | Greater than 58 cm |
| Via Fill Capability | Yes | Yes |
| Max Board Thickness | 2.4 mm | 3.10 mm |
| Min Copper Weight | 9 to 18 micron | 0.4 to 5 micron |
| Max Copper Weight | 3 oz. | 4 oz. |
| Shielding Method | Copper, Tatsuta, Silver Ink | Copper, Tatsuta, Silver Ink |
| Impedance Tolerance | +/- 10% | +/-5% |
| Assembly | BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201 | Flying Probe, Functional, JTAG, ICT |
| Testing | Flying Probe, Functional, JTAG, ICT | Yes |
| Conformal Coating | Yes | |
| Surface Finish | ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL | |
| Materials | FR4, 370HR, Polyimide, Nelco4000+, Rogers 4003+, I-Speed, … | |
| Panel Size | "9 x 12"", 12 x 12"", 12 x 18"", 12 x 24""" | |